Automatic Direct Eutectic Die Attach System
Automatic High Precision Die Attach System
Automatic Die Attach System
Automatic Die Bonding System (12” wafer handling)
Automatic Eutectic Die Bonding System
Automatic Die Attach System
Automatic Flip Chip Bonding System (12” wafer handling)
Die Bonder and Flip Chip Bonder
Automatic Clip Bonding System
Automatic Thermal Compression Bonding System
Automatic Die Bonding System (12” wafer handling)
Die Bonder and Flip Chip Bonder
Die Bonder and Flip Chip Bonder
Multi-Purpose Precision Pick & Place Tool
Automatic High Precision Die Attach System
High Speed Epoxy Die Bonder (for Vertical LED Application)
Automatic Die Bonding System (6” wafer handling)
Automatic Epoxy Die Attach System (6” wafer handling)
Automatic Die Bonder
Automatic Die Bonding System (8” wafer handling)
Automatic Epoxy Die Bonder
Automatic Soft Solder Die Bonding System
Automatic Epoxy Die Attach System (6” wafer handling)