Rotary Head Fine Aluminum Wire Bonding System
Automatic Direct Eutectic Die Attach System
Automatic High Precision Die Attach System
Automatic Die Attach System
Automatic Die Bonding System (12” wafer handling)
Automatic Eutectic Die Bonding System
Automatic Die Attach System
Automatic Flip Chip Bonding System (12” wafer handling)
Automatic Wire Bonder
For LED Applications
Die Bonder and Flip Chip Bonder
PVD 100-200 mm Wafer Processing